ASTM E865-20

Detailinformationen

Bezeichnung: ASTM E865-20

Ausgabedatum: 01.09.2020

Seiten: 4

Land: Amerikanische technische Norm

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Annotation

This specification covers structural film adhesives used for bonding honeycomb sandwich panels consisting of an aluminum alloy bonded to a nonmetallic core, edge attachments, and other components, and for new production or depot repair. The adhesive shall be manufactured in film form from a thermosetting compound suitable for forming bonds that can withstand long exposures to a range of temperatures and combinations of stress, temperature, and relative humidity encountered during service. The adhesive may be pure or consist of a carrier impregnated with adhesive and shall be uniform in appearance, with a weight in the range specified. Tests for shear, peel, durability, tensile strength, and storage life shall be performed and shall conform to the requirements specified.


Keywords:
adhesive bond, aluminum, bonding process, film adhesive, honeycomb sandwich panels, relocatable shelters,, ICS Number Code 83.180 (Adhesives)