IEC 61760-1-ed.4.0-CMV

Detailinformationen

Bezeichnung: IEC 61760-1-ed.4.0-CMV

Ausgabedatum: 23.06.2026

Seiten: 104

Land: Internationale technische Norm

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Erhältlich auf www.technormen.de

Annotation

IEC 61760-1:2026 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC 61760-1:2026 edition 4.0 and the previous IEC 61760-1:2020 edition 3.0. Furthermore, comments from IEC TC 91 experts are provided to explain the reasons of the most relevant changes, or to clarify any part of the content. IEC 61760-1:2026 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses. NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs. This edition includes the following significant technical changes with respect to the previous edition: a) added new subclause 4.2 - Classification of electronic assemblies; b) added new subclause 4.4.8 - Creepage and clearance distances - Insulation coordination; c) added new subclause 4.9 - Thermal and electrical performance; d) updated Clause 6 - Soldering: now including requirements related to application of low temperature solders; e) added new subclause 6.2.2 - Commonly used solder alloys; f) updated subclause 6.3.6 - Resistance to vacuum during soldering; g) updated subclause 6.3.7 - Resistance to cleaning media and processes - now includes the tests in IEC 60068-2-88, Tests - Test XD: Resistance of components and assemblies to liquid cleaning media; h) added new subclause 6.3.9 - Rework of soldered components; i) added new Annex B - Sustainability.