IEC 63055-ed.2.0

Detailinformationen

Bezeichnung: IEC 63055-ed.2.0

Ausgabedatum: 11.10.2023

Seiten: 292

Land: Internationale technische Norm

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Erhältlich auf www.technormen.de

Annotation

IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.