IEEE White Paper

Detailinformationen

Bezeichnung: IEEE White Paper

Ausgabedatum: 12.05.2026

Seiten: 0

Land: Internationale technische Norm

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Erhältlich auf www.technormen.de

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The automotive industry is at a technological inflection point as increasing system complexity, performance demands, and cost pressures expose the limitations of traditional monolithic SoC?based ECU architectures. The transition toward centralized, high?performance, server?like vehicle computing motivates the adoption of alternative design approaches. This white paper summarizes insights from the IEEE MaaS webinar “Mind the Gaps: The Automotive Industry in Turmoil – Chiplets to the Rescue?” (March 5, 2025), examining the potential of chiplet?based architectures for automotive applications. It highlights enabling standards such as Universal Chiplet Interconnect Express (UCIe), Bunch of Wires (BoW), and Advanced Interface Bus (AiB), and discusses the system?level implications for packaging, reliability, and supply?chain adaptation

ISBN: 979-8-8557-3467-6
Number of Pages: 16
Product Code: STDVA28843
Keywords: automotive, chiplet, Industry Connections, MaaS, mobility as a service, standards development, supply chain
Category: Vehicular/Transportation Technology|General/Other - Control and Automation