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AERODYNAMIC FAIRING COMPOUND -55° to +150°C (-65° to +300°F)
Available languages: English
Available design: electronic design (pdf), Print design
AERODYNAMIC FAIRING COMPOUND -55° to +150°C (-65° to +300°F)
Available languages: English
Available design: electronic design (pdf), Print design
ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, -55° to +230°C (-67° to +450°F)
Available languages: English
Available design: electronic design (pdf), Print design
ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, -55° to +230°C (-65 to +450°F)
Available languages: English
Available design: electronic design (pdf), Print design
ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, -55 to +230 °C (-65 to +450 °F)
Available languages: English
Available design: electronic design (pdf), Print design
RESIN SYSTEM, EPOXY, CARBON MICROBALLOON FILLED 135°C (275°F) Cure
Available languages: English
Available design: electronic design (pdf), Print design
EPOXY RESIN, TETRAGLYCIDYL METHYLENEDIANILINE (TGMDA) 10,000 – 14,000 Centipoise Viscosity
Available languages: English
Available design: electronic design (pdf), Print design
EPOXY RESIN, TETRAGLYCIDYL METHYLENEDIANILINE (TGMDA) 10,000 TO 14,000 Centipoise Viscosity
Available languages: English
Available design: electronic design (pdf), Print design
EPOXY RESIN, TETRAGLYCIDYL METHYLENEDIANILINE (TGMDA) 10,000 to 14,000 Centipoise (10 to 14 Pa·s) Viscosity
Available languages: English
Available design: electronic design (pdf), Print design
Epoxy Resin, Tetraglycidyl Methylenedianiline (TGMDA), 10,000 to 14,000 Centipoise Viscosity (Canceled)
Available languages: English
Available design: electronic design (pdf), Print design