ČSN - Czech national standards

Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Available design: Print design

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade (includes Amendment A1:1994)

Available design: Print design

Base materials for printed circuits - Part 2: Specifications - Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Available design: Print design

Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability (includes Amendment A1:1994)

Available design: Print design

Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Available design: Print design

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Available design: Print design

Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleinimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Available design: Print design

Base materials for printed circuits. Part 2: Specifications. Specification No. 19: Thin bismaleinimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards (includes Amnedment A1:1994)

Available design: Print design

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

Available languages: English (the title page in Czech only)

Available design: Print design