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Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
Available languages: English (the title page in Czech only)
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide, woven E-glass prepreg of defined flammability
Available languages: English (the title page in Czech only)
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Available languages: English (the title page in Czech only)
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Available languages: English (the title page in Czech only)
Available design: Print design
Materials for interconnection structures. Part 5: Sectional specification set for conductive foils and films with and without coatings. Section 1: Copper foils (for the manufacture of copper-clad base materials)
Available languages: Czech
Available design: Print design
Materials for interconnection structures. Part 5: Sectional specification set for conductive foils and films with and without coatings. Section 4: Conductive inks
Available languages: Czech
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
Available languages: English
Available design: Print design
Materials for interconnection structures. Part 7: Sectional specification set for restraining core materials. Section 1: Copper/invar/copper
Available languages: Czech
Available design: Print design
Materials for interconnection structures. Part 8: Sectional specification set for non-conductive films and coatings. Section 7: Marking legend inks
Available languages: Czech
Available design: Print design
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Available languages: Czech
Available design: Print design