JIS - Japanese technical standards

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Copper foil for printed wiring boards

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

General rules of prepreg for multilayer printed wiring boards

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Test methods of prepreg for multilayer printed wiring boards

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Concentric plugs and jacks

Available languages: English, Japanese

Available design: electronic design (pdf), Print design

Toggle switches for use in electronic equipment

Available languages: Japanese

Available design: electronic design (pdf), Print design

Miniature fuses -- Part 1: Definitions of miniature fuses and general requirements for miniature fuse-links (Amendment 2)

Available languages: Japanese

Available design: electronic design (pdf), Print design