UNE - Spanish national standards

Materials for printed boards and other interconnecting structures -- Part 2-9: Reinforced base materials clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Available languages: English, Spanish

Available design: electronic design (pdf), Print design

Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.

Available languages: English, Spanish

Available design: electronic design (pdf), Print design

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM

Available languages: English, Spanish

Available design: electronic design (pdf), Print design

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.

Available languages: English, Spanish

Available design: electronic design (pdf), Print design

Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by Asociación Espanola de Normalización in August of 2026.)

Available languages: English

Available design: electronic design (pdf), Print design

Materials for interconnecting structures -- Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability. (Endorsed by AENOR in September of 2008.)

Available languages: English

Available design: electronic design (pdf), Print design

Materials for printed boards and other interconnecting structures -- Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)

Available languages: English

Available design: electronic design (pdf), Print design

Materials for printed boards and other interconnecting structures -- Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)

Available languages: English

Available design: electronic design (pdf), Print design

Materials for printed boards and other interconnecting structures -- Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)

Available languages: English

Available design: electronic design (pdf), Print design

Materials for printed boards and other interconnecting structures -- Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)

Available languages: English

Available design: electronic design (pdf), Print design