Withdrawn | Published: 01/09/2009

ASTM B579-73(2009) Withdrawn

Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)

Available languages: English

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Detail information

Designation: ASTM B579-73(2009)

Publication date: 01/09/2009

Pages: 5

Note: Withdrawn

Country: American technical standard

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Keywords:
electrodeposited coatings, tin-lead alloy (solder plate), solder, tin-lead alloy, tin-lead, Artificial aging, Bend testing--coatings, Burnishing test--for coating adhesion, Coating adhesion--electrodeposited coatings, Copper alloy electrodeposited coatings, Dip test, Electrodeposited Sn coatings--specifications, Globule test, Iron products (general)--electrodeposited coatings, Lead-tin alloys/coatings--specifications, Printed circuits, Quenching, Reflow test

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