Withdrawn | Published: 10/10/1999

ASTM D5109-99(2004) Withdrawn

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

Available languages: English

Available design: Online Secure PDF, Print design

from 86.00 USD show on eshop

Detail information

Designation: ASTM D5109-99(2004)

Publication date: 10/10/1999

Pages: 8

Note: Withdrawn

Country: American technical standard

Where to buy?

You can buy at www.mystandards.biz

Anotation

Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)

Popular Publishers

full catalog