ASTM D5213-19 img
Active standard | Published: 01/03/2019

ASTM D5213-19

Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications

Available languages: English

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Detail information

Designation: ASTM D5213-19

Publication date: 01/03/2019

Pages: 7

Country: American technical standard

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Anotation

This specification establishes the requirements for the material, dimensions and tolerances, and property values of polymeric resin films, in sheet or strip form, for use in electrical insulation and dielectric applications. Type I are flexible unsupported films for general purpose, while Type II are heat-sealable coated on one (Grade 1) or both (Grade 2) sides. Materials covered here are (A) poly(N,N´-p,p´-oxydiphenylene pyromellitimide), (B) poly(N,N´-p,p´-oxydiphenylene biphenyltetracarboxylimide, (C) poly(N,N´-p-phenylene biphenyltetracarboxylimide), (D) FEP-fluorocarbon, (E) polyethylene terephthalate, (F) polyethylene naphthalate, and (G) polyetherimide. Individual materials class of films shall be tested and conform accordingly the following property values: tensile strength; elongation; shrinkage; moisture absorption; dielectric strength; volume resistivity; permittivity; and dissipation factor.


Keywords:
conditioning, dielectric strength, dissipation factor, elongation, FEP fluorocarbon, film, fluorinated poly(ethylene-propylene), heat-seal strength, heatsealable, permittivity, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyimide, poly(N, N`-p, p`-oxydiphenylene biphenyltetracarboxylimide), poly(N, N`-p, p`oxydiphenylene pyromellitimide), poly(N, N`-p-phenylene biphenyltetra-carboxylimide), shrinkage, tensile strength, thickness, volume resistivity,
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