Withdrawn | Published: 01/06/2011

ASTM F1238-95(2011) Withdrawn

Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

Available languages: English

Available design: Online Secure PDF

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Detail information

Designation: ASTM F1238-95(2011)

Publication date: 01/06/2011

Pages: 3

Note: Withdrawn

Country: American technical standard

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Keywords:
density, microelectronics, molybdenum disilicide, refractory silicides, sputtering, sputtering targets, tantalum disilicide, titanium disilicide, tungsten disilicide, Electrical conductors (semiconductors)--specifications, Electronic materials/applications--specifications, Metallic silicide, Molybdenum (electronic applications)--specifications, Polycaprolactone (PCL), Refractory silicide targets, Silicides, Tantalum (Ta)/tantalum alloys--specifications, Targets, Titanium silicide

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