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Active standard | Published: 01/08/2021
ČSN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Available languages: English
Available design: Print design
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Detail information
Designation: ČSN EN IEC 61188-6-2
Publication date: 01/08/2021
Pages: 36
Country: Czech technical standard
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This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191 2:2017.Popular Publishers
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