ČSN EN IEC 61189-2-808

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

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Detail information

Designation: ČSN EN IEC 61189-2-808

Publication date: 01/10/2024

Pages: 32

Country: Czech technical standard

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Anotation

This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE - This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A

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