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Active standard | Published: 01/01/2022
ČSN EN IEC 62878-2-602
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity
Available languages: English
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Detail information
Designation: ČSN EN IEC 62878-2-602
Publication date: 01/01/2022
Pages: 24
Country: Czech technical standard
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High-end servers, network systems and smart phones have been driving the electronic assembly technologies for the last couple of decades. Any applications to enable the "Internet of Things" (aka IoT) require new electronic assembly technologies to achieve small size, low energy consumption and robust security in a cost-effective way.This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules
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