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Active standard | Published: 09/05/2013
GB/T 29507-2013
Test method for measuring flatness, thickness and total thickness variation on silicon wafers by automated non-contact scanning
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 339.70 EUR
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Detail information
Designation: GB/T 29507-2013
Publication date: 09/05/2013
Pages: 0
Country: Chinese technical standard
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