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Active standard | Published: 28/12/2023
GB/T 43536.2-2023
Three dimensional integrated circuits—Part 2Alignment of stacked dies having fine pitch interconnect
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 6 833.40 CZK
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Detail information
Designation: GB/T 43536.2-2023
Publication date: 28/12/2023
Pages: 0
Country: Chinese technical standard
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