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Active standard | Published: 26/10/2024
GB/T 44775-2024
Integrated circuit 3D packaging— Requirement for die stack process and evaluation
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 490.80 USD
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Detail information
Designation: GB/T 44775-2024
Publication date: 26/10/2024
Pages: 0
Country: Chinese technical standard
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