Active standard | Published: 14/10/2019

IEC/TR 60286-7-ed.1.0

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
(Emballage de composants pour operations automatisees - Partie 7: Introduction d’une plaquette thermoformee en volume pour des composants miniaturises)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC/TR 60286-7-ed.1.0

Publication date: 14/10/2019

Pages: 24

Country: International technical standard

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Anotation

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging. L’IEC TR 60286-7:2019 contient des informations sur l’introduction d’un systeme innovant de conditionnement par plaquette thermoformee en volume pour des composants miniaturises, par exemple des composants de type puce d’une taille inferieure ou egale a 1005 (metrique). Elle comprend une proposition de normalisation de l’interface entre les systemes d’emballage et de montage automatique ainsi que les exigences relatives aux proprietes de l’emballage.

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