Active standard | Published: 26/06/2019

IEC/TR 61189-5-506-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Available languages: English

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Detail information

Designation: IEC/TR 61189-5-506-ed.1.0

Publication date: 26/06/2019

Pages: 0

Country: International technical standard

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Anotation

IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

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