IEC/TR 62258-3-ed.2.0

Detail information

Designation: IEC/TR 62258-3-ed.2.0

Publication date: 06/08/2010

Pages: 109

Country: International technical standard

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Anotation

IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly. This edition includes the following significant technical changes with respect to the previous edition. 1. Special requirements have been added throughout the document for optical die, where applicable. For example see 4.3 paragraph 4 and 10.1.3 paragraph 3. 2. The following new subclauses have been added: - 4.4.6 ESD Guidelines - 5.1 Wafer thinning 3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including: - 5.2.2 Wafer scribing - 5.2.3 Laser cutting - 5.2.4 Dice before grind (DBG) 4. Subclause 5.3.7 (previous edition Subclause 5.2.7) has been changed to include optical and microwave die. 5. In Subclause 6.3, the Subclause 6.3.2 (Specialised wafer tubs) has been added to include wafer taubs specially handle and ship wafers that have not been singulated. 6. Two new Subclauses have been to Clause 6: - 6.9 Handling and packing of thinned die or wafers - 6.10 Packing materials and their reuse 7. A new subclause has been added to Subclause 9.6: - 9.6.3 Use of packing material having sacrificial properties 8. Annex A (Planning checklist) has been updated throughout. 9. In Annex B (Material specifications) a new Subclause has been added: - B.5 Adhesive gel tray material specifications. La CEI/TR 62258-3:2010 a ete elabore afin de faciliter la production, la fourniture et lutilisation de produits a puces de semi-conducteurs, y compris: - les tranches, - les puces nues isolees, - les puces et tranches munies de leurs structures de connexion, - et les puces et tranches a encapsulation minimale ou partielle. Le present rapport fournit les bonnes pratiques suggerees en matiere de manipulation, de conditionnement et de stockage des produits a puces. Pour que la fabrication densembles electroniques contenant des produits a puces soit couronnee de succes, il faut preter une attention particuliere a la manipulation, au stockage et aux conditions environnementales. Le present rapport fournit des lignes directrices et des instructions, fondees sur lexperience acquise dans la pratique industrielle; il est particulierement utile pour ceux qui integrent pour la premiere fois des produits a puces dans des ensembles. Il est egalement concu comme une aide a letablissement et a laudit des installations qui manipulent ou utilisent des produits a puces nues, depuis la fabrication des tranches jusqua lassemblage final. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente. 1. Des exigences particulieres concernant les puces optiques ont ete ajoutees tout au long du document. Par exemple voir 4.3 alinea 4 et 10.1.3 alinea 3. 2. Les nouveaux paragraphes suivants ont ete ajoutes: - 4.4.6 Lignes directrices en matiere de decharges electrostatiques (ESD). - 5.1 Amincissement dune tranche. 3. Le paragraphe 5.2 (Singulation ou separation de puces) a ete renomme sur la base de lancien paragraphe 5.1 (Sciage des tranches) et a ete etendu pour inclure dautres methodes de singulation ou de sciage comprenant: - 5.2.2 Tracage de chemins de decoupe des tranches - 5.2.3 Decoupage au laser - 5.2.4 Methode de decoupage avant polissage (DBG). 4. Le Paragraphe 5.3.7 (Paragraphe 5.2.7 de lancienne edition) a ete modifie pour inclure les puces optiques et hyperfrequences. 5. Au paragraphe 6.3, le paragraphe 6.3.2 (boitiers speciaux pour tranches) a ete ajoute pour inclure la manipulation speciale des tranches et le transport des tranches qui nont pas ete singulees. 6. Deux nouveaux paragraphes ont ete ajoutes a lArticle 6: - 6.9 Manipulation et emballage de puces ou tranches amincies - 6.10 Materiaux demballage et leur reutilisation. 7. Un nouveau paragraphe a ete ajoute au Paragraphe 9.6: - 9.6.3 Utilisation de materiaux demballage sacrificiels. 8. LAnnexe A (Liste de controle pour planification) a ete completement mise a jour. 9. A lAnnexe B (Specification des materiaux) un nouveau paragraphe a ete ajoute: - B.5 Specifications des materiaux du plateau a gel adhesif.