IEC/TS 61967-3-ed.2.0

Detail information

Designation: IEC/TS 61967-3-ed.2.0

Publication date: 25/08/2014

Pages: 73

Country: International technical standard

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Anotation

IEC TS 61967-3:2014 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain. This edition includes the following significant technical changes with respect to the previous edition: a) Removal of: Clause 9.4 Data analysis and Annex D Analysing the data from near-field surface scanning; b) Addition of: Introduction, Clause 9.4 Measurement data, Clause 9.5 Post-processing, Clause 9.6 Data exchange and Annex D Coordinate systems; c) Expansion of: Clause 8.4 Test technique and Annex A Calibration of near-field probes. LIEC TS 61967-3:2014 fournit une procedure dessai qui definit une methode devaluation des composants de champs proches electriques, magnetiques ou electromagnetiques emis a la surface ou pres de la surface dun circuit integre (CI). Cette procedure de diagnostic est destinee a lanalyse architecturale du CI telle que la gestion de couches et loptimisation de la distribution de puissance. Cette procedure dessai sapplique aux mesures effectuees sur un CI monte sur tout circuit imprime accessible a la sonde de balayage. Il est dans certains cas utile de balayer lenvironnement en plus du CI. Pour la comparaison des emissions de balayage en surface entre differents CI, il convient dutiliser la carte dessai normalisee definie dans lIEC 61967-1. Cette methode de mesure fournit un mapping des emissions de champs proches electriques ou magnetiques emis a la surface du CI. La resolution de la mesure est determinee par laptitude de la sonde de mesure et la precision du systeme de positionnement de la sonde. Cette methode est destinee a une utilisation jusqua 6 GHz. Lextension de la limite superieure de la frequence est possible avec la technologie actuelle en matiere de sondes, mais cela nentre pas dans le domaine dapplication de la presente specification. Les mesures peuvent etre effectuees dans le domaine de frequence ou le domaine temporel. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) Suppression de: lArticle 9.4 Analyse des donnees et a lAnnexe D Analyse des donnees a partir du balayage en surface de champ proche; b) Addition de: lIntroduction, lArticle 9.4 Donnees de mesure, lArticle 9.5 Post-traitement, lArticle 9.6 Echange des donnees et a lAnnexe D Systemes de coordonnees; c) Developpement de: lArticle 8.4 Technique dessai et lAnnexe A Etalonnage des sondes de champs proches.