Active standard | Published: 27/05/2025

IEC 60068-2-83-ed.2.0-RLV

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60068-2-83-ed.2.0-RLV

Publication date: 27/05/2025

Pages: 124

Country: International technical standard

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Anotation

IEC 60068-2-83:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 specifies visual evaluation using solder bath and reflow method, IEC 60068-2-69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068-2-20:2021.

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