IEC 60191-6-13-ed.2.0

Detail information

Designation: IEC 60191-6-13-ed.2.0

Publication date: 27/09/2016

Pages: 36

Country: International technical standard

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Anotation

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition: a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4. LIEC 60191-6-13:2016 specifie un guide de conception des supports a semiconducteurs sans couvercle pour les boitiers matriciels a billes et a pas fins (FBGA, fine-pitch ball grid array) et les boitiers matriciels a zone de contact plate et a pas fins (FLGA, fine-pitch land grid array). En particulier, la presente partie de lIEC 60191 etablit les dessins dencombrement et les dimensions des supports sans couvercle dessais et de rodage appliques aux FBGA et aux FLGA. La presente edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) La longueur et la largeur nominales du boitier BGA ont recemment ete etendues respectivement a 43 mm et 43 mm. En consequence, six tailles de supports ont ete ajoutees aux groupes de supports numeros 1, 2 et 3, et vingt-deux tailles de supports ont ete ajoutees au groupe de support numero 4.