Active standard | Published: 30/08/2010

IEC 60191-6-20-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-20: Regles generales pour la preparation des dessins d´encombrement des boitiers pour dispositifs a semiconducteurs pour montage en surface - Methodes de mesure pour les dimensions des boitiers a sortie en J (SOJ) de faible encombrement)

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Detail information

Designation: IEC 60191-6-20-ed.1.0

Publication date: 30/08/2010

Pages: 21

Country: International technical standard

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Anotation

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4. La CEI 60191-6-20:2010 specifie les methodes destinees a mesurer les dimensions des boitiers a sortie en J (SOJ) de faible encombrement, lencombrement des boitiers de forme E conformement a la CEI 60191-4.

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