IEC 60317-35-ed.2.2+Amd.1+Amd.2-CSV

Detail information

Designation: IEC 60317-35-ed.2.2+Amd.1+Amd.2-CSV

Publication date: 14/06/2024

Pages: 24

Country: International technical standard

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Anotation

IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1B: 0,020 mm up to and including 0,800 mm; - Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - modification to Clause 15 to remove specific wire specimen sizes; - consolidation of 17.1 and 17.2 of the solderability requirements; - new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating