IEC 60691-ed.5.2+Amd.1+Amd.2-CSV img
Active standard | Published: 09/02/2026

IEC 60691-ed.5.2+Amd.1+Amd.2-CSV

Thermal-links - Requirements and application guide

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60691-ed.5.2+Amd.1+Amd.2-CSV

Publication date: 09/02/2026

Pages: 88

Country: International technical standard

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Anotation

IEC 60691:2023+AMD1:2024+AMD2:2026 CSV is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. NOTE 1 The equipment is not designed to generate heat. NOTE 2 The effectiveness of the protection against excessive temperatures logically depends upon the position and method of mounting of the thermal-link, as well as upon the current which it is carrying. This document may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This document may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its position.
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