IEC 60748-20-ed.1.0

Detail information

Designation: IEC 60748-20-ed.1.0

Publication date: 30/06/1988

Pages: 83

Country: International technical standard

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Anotation

Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures. Sapplique aux circuits integres a couches et aux circuits integres hybrides a couches actifs et passifs. Sapplique egalement aux CIHC et C semi-finis fournis a des clients pour traitement ulterieur et aux circuits type boitiers paves (chip carrier) a plus dun cristal, pourvu quils soient interconnectes par les techniques dinterconnexion a couches. Definit les procedures dassurance de la qualite et les methodes dessais electriques, climatiques, mecaniques et dendurance. Formule les exigences qui sappliquent a lacceptation des circuits utilisant soit les procedures dhomologation, soit les procedures dagrement de savoir-faire.