Active standard | Published: 31/08/2020

IEC 60749-20-ed.3.0

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 20 : Resistances des CMS a boitier plastique a l’effet combine de l’humidite et de la chaleur de brasage)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60749-20-ed.3.0

Publication date: 31/08/2020

Pages: 55

Country: International technical standard

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Anotation

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes. L’IEC 60749-20:2020 fournit des moyens d’evaluer la resistance a la chaleur de brasage des semiconducteurs sous emballage comme les composants a boitier plastique pour montage en surface (CMS). Cet essai est destructif. Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: - incorporation d’un corrigendum de l’IEC 60749-20:2008 (deuxieme edition), - inclusion d’un nouvel Article 3, - inclusion de notes explicatives.

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