Active standard | Published: 11/07/2003

IEC 60749-25-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 25: Cycles de temperature)

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Detail information

Designation: IEC 60749-25-ed.1.0

Publication date: 11/07/2003

Pages: 25

Country: International technical standard

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Anotation

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing. Fournit une procedure dessai pour determiner la capacite des dispositifs a semiconducteurs et des composants et/ou des cartes equipees a resister aux contraintes mecaniques induites en alternant des extremes de hautes et basses tempera-tures. Des variations permanentes des caracteristiques electriques et/ou physiques peuvent resulter de ces contraintes mecaniques. Sapplique aux cycles de temperature en chambre unique, double et triple et englobe les essais de composants et dinterconnexions soudees.

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