IEC 60749-30-ed.2.0

Detail information

Designation: IEC 60749-30-ed.2.0

Publication date: 17/08/2020

Pages: 26

Country: International technical standard

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Anotation

IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications. L’IEC 60749-30:2020 etablit une procedure normalisee de determination du preconditionnement pour les composants pour montage en surface (CMS) non hermetiques avant les essais de fiabilite. Cette methode d’essai definit une refusion de preconditionnement pour les CMS a l’etat solide non hermetiques representative d’une operation de refusion de soudure multiple industrielle type. Les CMS sont soumis a la sequence de preconditionnement appropriee decrite dans le present document avant d’etre soumis aux essais de fiabilite sur place specifiques (qualification et/ou surveillance de la fiabilite) pour evaluer la fiabilite a long terme (qui pourrait etre affectee par la refusion de soudure). Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - ajout du nouvel Article 3; - extension de 6.7 concernant la refusion de soudure; - inclusion de notes explicatives et de clarifications.