Active standard | Published: 30/10/2007

IEC 61188-5-4-ed.1.0

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-4: Considerations sur les liaisons pistes-soudures - Composants a sorties en J sur deux cotes)

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Detail information

Designation: IEC 61188-5-4-ed.1.0

Publication date: 30/10/2007

Pages: 29

Country: International technical standard

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Anotation

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. La CEI 61188-5-4:2007 fournit les dimensions des composants et des plages daccueil des circuits integres a faible encombrement ayant des soties en J sur les deux cotes (composants SOJ) utilises dans le procede de brasage par fusion. La construction de base des systemes SOJ est egalement couverte. Larticle 4 enumere les tolerances et les dimensions de reference des joints de brasure utilises pour parvenir aux dimensions des plages daccueil.

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