Active standard | Published: 23/01/2003

IEC 61188-5-6-ed.1.0

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-6: Considerations sur les liaisons pistes-soudures - Composants a sorties en J sur quatre cotes)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61188-5-6-ed.1.0

Publication date: 23/01/2003

Pages: 37

Country: International technical standard

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Anotation

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints. Donne des informations sur les geometries de zones de report utilisees pour la fixation des composants electroniques avec des sorties en J sur les quatre cotes. Fournit les dimensions, les formes et les tolerances appropriees des zones de report de montage en surface afin de garantir une surface suffisante au raccord de brasure approprie et permet egalement linspection, les essais et les retouches des joints de brasure.

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