Active standard | Published: 30/10/2007

IEC 61188-5-8-ed.1.0

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-8: Considerations sur les liaisons pastilles/joints - Composants matriciels (BGA, FBGA, CGA, LGA))

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61188-5-8-ed.1.0

Publication date: 30/10/2007

Pages: 61

Country: International technical standard

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Anotation

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with IEC 61188-5-1:2002. La CEI 61188-5-8:2007 fournit des informations sur la geometrie des plages daccueil utilisees pour la fixation en surface des composants electroniques a sorties matricielles de forme de boules de brasure, de colonnes de brasure ou de pastilles recouvertes dune protection. Le but des informations indiquees dans la presente norme est de fournir les dimensions, formes et tolerances appropriees des plages daccueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure et pour permettre linspection, la mise en essai et les retouches des joints de brasure. Cette publication doit etre lue conjointement avec la CEI 61188-5-1:2002.

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