Active standard | Published: 04/02/2021

IEC 61188-6-2-ed.1.0

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-2: Conception de la zone de report - Description de la zone de report pour les composants montes en surface (CMS) les plus courants)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61188-6-2-ed.1.0

Publication date: 04/02/2021

Pages: 49

Country: International technical standard

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Anotation

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017. L’IEC 61188-6-2:2021 decrit les exigences de conception et d’utilisation relatives aux surfaces de brasage de la zone de report sur les cartes imprimees. Le present document porte notamment sur la zone de report des composants montes en surface. Ces exigences se fondent sur les exigences relatives aux joints de brasure de l’IEC 61191-2:2017.

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