Active standard | Published: 22/11/2001

IEC 61189-1-ed.1.1+Amd.1-CSV

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
(Methodes d´essai pour les materiaux electriques, les structures d´interconnexion et les ensembles - Partie 1: Methodes d´essai generales et methodologie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61189-1-ed.1.1+Amd.1-CSV

Publication date: 22/11/2001

Pages: 51

Country: International technical standard

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Anotation

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication. Cette serie porte sur les methodes dessais applicables aux cartes imprimees et equipees ainsi que sur la robustesse des materiaux et des composants employes sans tenir compte de leur mode de fabrication. Cette partie comporte des methodes dessai applicables aux materiaux utilises pour constituer des structures dinterconnexion (cartes imprimees) et des ensembles electroniques. Ces methodes sont decrites de telle sorte que luniformite et la reproductibilite des procedures et des methodologies dessai soient assurees. Cette version consolidee comprend la premiere edition (1997) et son amendement 1 (2001). Il nest donc pas necessaire de commander lamendement avec cette publication.

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