Active standard | Published: 25/08/2023

IEC 61189-2-804-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 2-804: Methodes d´essai pour le temps de decollement interlaminaire - T260, T288, T300)

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Detail information

Designation: IEC 61189-2-804-ed.1.0

Publication date: 25/08/2023

Pages: 0

Country: International technical standard

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Anotation

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values. LIEC 61189-2-804:2023 definit une methode dessai pour determiner le temps de decollement interlaminaire des materiaux de base et des cartes imprimees en utilisant un analyseur thermomecanique (TMA – thermomechanical analyser). Les temperatures utilisees pour cette evaluation sont generalement 260 °C, 288 °C et 300 °C, mais ne se limitent pas a ces valeurs.

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