Active standard | Published: 05/01/2016

IEC 61189-3-719-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 3-719: Methodes d´essai pour les structures d´interconnexion (cartes imprimees) - Controles de la variation de resistance des trous metallises uniques (PTH) au cours des cycles de temperatures)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61189-3-719-ed.1.0

Publication date: 05/01/2016

Pages: 22

Country: International technical standard

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Anotation

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling. LIEC 61189-3-719:2016 specifie une methode dessai pour controler la resistance des trous metallises uniques (PTH) dans les cartes de circuits imprimes (PCB), afin de determiner la durabilite des PTH sous contrainte thermomecanique induite par les cycles de temperatures.

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