Active standard | Published: 08/01/2015

IEC 61189-5-3-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-3: Methodes d´essai des assemblages de cartes imprimees: Pate de brasage)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61189-5-3-ed.1.0

Publication date: 08/01/2015

Pages: 79

Country: International technical standard

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Anotation

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007. LIEC 61189-5-3:2015 est un catalogue de methodes dessai representant les methodologies et modes operatoires pouvant etre appliques aux assemblages de cartes imprimees. La presente partie de lIEC 61189 traite des methodes dessai pour la pate de brasage sur la base des IEC 61189-5 et IEC 61189-6 existantes. De plus, elle inclut les methodes dessai pour la pate de brasage pour le brasage sans plomb. Cette publication doit etre lue conjointement avec laCEI 61189-1:1997, la CEI 61189-2:2006 et la CEI 61189-3:2007

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