IEC 61190-1-3-ed.3.0

Detail information

Designation: IEC 61190-1-3-ed.3.0

Publication date: 13/12/2017

Pages: 86

Country: International technical standard

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Anotation

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the materials performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys. LIEC 61190-1-3:2017 prescrit les exigences et methodes dessai pour les alliages a braser de categorie electronique, les brasures en baguette, en ruban et en poudre fluxees et non fluxees et les pates a braser, pour les applications de brasage electronique et pour les brasures de categorie electronique "speciales". Pour les specifications generiques relatives aux alliages et aux flux a braser, voir lISO 9453. Le present document est un document de controle de la qualite et na pas pour objet de sinteresser directement a la performance du materiau au cours du procede de fabrication. La presente edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) Le niveau maximal dimpurete du plomb a ete revise et le tableau dalliages a braser sans plomb qui comporte des alliages a braser sans plomb supplementaires.