IEC 61191-1-ed.3.0

Detail information

Designation: IEC 61191-1-ed.3.0

Publication date: 14/09/2018

Pages: 89

Country: International technical standard

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Anotation

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies. L’IEC 61191-1:2018 etablit les exigences relatives aux materiaux, methodes et criteres de verification utilises dans le cadre de la production d’interconnexions et d’ensembles brases de qualite faisant appel a la technique de montage en surface ainsi qu’a des techniques d’assemblage associees. La presente partie de l’IEC 61191 comprend egalement des recommandations concernant la qualite des processus de fabrication. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - les exigences ont ete mises a jour pour etre conformes aux criteres d’acceptation de l’IPC-A-610F; - le terme "dessin d’assemblage" a ete remplace partout par "document d’assemblage"; - les references aux normes IEC ont ete corrigees; - l’Article 9 a ete entierement reecrit; - l’Annexe B a ete retiree car des procedures d’assemblages de cartes a circuits existent deja.