IEC 61191-2-ed.3.0

Detail information

Designation: IEC 61191-2-ed.3.0

Publication date: 23/05/2017

Pages: 33

Country: International technical standard

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Anotation

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added. The contents of the corrigendum of September 2019 have been included in this copy. L’IEC 61191-2:2017 specifie les exigences relatives aux connexions brasees pour montage en surface. Les exigences se rapportent aux ensembles integrant uniquement le montage en surface ou aux portions d’ensembles pour montage en surface incluant d’autres technologies associees (par exemple montage par trous traversants, montage a puce, a borne, etc.). Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) mise a jour des exigences pour qu’elles soient conformes aux criteres d’acceptation de l’IPC-A-610F; b) mise a jour d’une partie de la terminologie utilisee dans le present document; c) correction des references aux normes IEC; d) ajout de cinq styles de terminaisons.