IEC 61191-6-ed.1.0

Detail information

Designation: IEC 61191-6-ed.1.0

Publication date: 14/01/2010

Pages: 76

Country: International technical standard

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Anotation

IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly. La CEI 61191-6:2010 specifie les criteres devaluation pour les vides a lechelle de la duree de vie du cycle thermique et la methode de mesure des vides au moyen dobservations aux rayons X. La presente partie de la CEI 61191 sapplique aux vides generes dans les joints de brasure des boitiers BGA et LGA brases sur une carte. La presente partie de la CEI 61191 ne sapplique pas au boitier BGA lui-meme avant quil ne soit assemble sur une carte. La presente norme sapplique egalement aux dispositifs dont les joints sont realises par fusion et resolidification, tels que les dispositifs a puce retournee (flip chip) et les modules multipuce, en plus des BGA et des LGA. La presente norme ne sapplique pas aux joints presentant un manque de metal entre un dispositif et une carte ni aux joints de brasure a linterieur dun boitier de dispositif. La presente norme sapplique aux macrovides de tailles compris entre 10 µm et plusieurs centaines de micrometres se produisant dans un joint brase, mais elle ne sapplique pas aux vides plus petits (typiquement, microvides planaires) dont le diametre est inferieur a 10 µm. La presente norme est destinee a levaluation et sapplique aux etudes de recherche, controle du processus de fabrication hors ligne et evaluation de la fiabilite de lassemblage.