Active standard | Published: 11/05/2023

IEC 61249-2-51-ed.1.0

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 2-51: Materiaux de base renforces, plaques et non plaques - Materiaux de base pour bande support de carte a circuit integre, non plaques)

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Detail information

Designation: IEC 61249-2-51-ed.1.0

Publication date: 11/05/2023

Pages: 33

Country: International technical standard

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Anotation

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film. L’IEC 61249-2-51:2023 specifie les exigences relatives a la construction, aux materiaux et aux proprietes, ainsi qu’a l’assurance qualite, a l’emballage, au marquage et au stockage des materiaux de base pour bande support de carte a circuit integre, non plaques (ici designes par materiaux de base pour bande support de CI). Le present document s’applique aux materiaux de base pour bande support de CI ; il s’agit d’un materiau recouvert de colle, un cote etant compose d’une sous-couche epoxy renforcee en tissu de verre de type E, l’autre cote etant recouvert d’un adhesif et protege par une pellicule antiadhesive.

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