IEC 61760-1-ed.4.0

Detail information

Designation: IEC 61760-1-ed.4.0

Publication date: 23/06/2026

Pages: 105

Country: International technical standard

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Anotation

IEC 61760-1:2026 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses. NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs. This edition includes the following significant technical changes with respect to the previous edition: a) added new subclause 4.2 - Classification of electronic assemblies; b) added new subclause 4.4.8 - Creepage and clearance distances - Insulation coordination; c) added new subclause 4.9 - Thermal and electrical performance; d) updated Clause 6 - Soldering: now including requirements related to application of low temperature solders; e) added new subclause 6.2.2 - Commonly used solder alloys; f) updated subclause 6.3.6 - Resistance to vacuum during soldering; g) updated subclause 6.3.7 - Resistance to cleaning media and processes - now includes the tests in IEC 60068-2-88, Tests - Test XD: Resistance of components and assemblies to liquid cleaning media; h) added new subclause 6.3.9 - Rework of soldered components; i) added new Annex B - Sustainability. LIEC 61760-1:2026 definit les exigences relatives aux specifications des composants electroniques destines a etre utilises dans la technologie de montage en surface. A cette fin, elle specifie un ensemble de reference de conditions de procede et de conditions dessai associees a prendre en compte lors de lelaboration des specifications des composants. Lobjectif du present document est de sassurer quune grande variete de CMS peut etre soumise au meme placement, au meme montage et aux memes processus ulterieurs (par exemple, nettoyage, inspection) pendant lassemblage. Le present document definit les essais et les exigences qui sont inclus dans la specification generale, intermediaire ou particuliere dun composant de CMS. En outre, le present document fournit aux utilisateurs et aux fabricants de composants un ensemble de reference de conditions de processus types utilisees dans la technologie de montage en surface. Certaines des exigences relatives aux specifications des composants du present document sont egalement applicables aux composants avec des sorties destinees a etre montees sur une carte de circuit imprime, y compris la technologie dinterconnexion sans soudure. Les cas pour lesquels cela est approprie sont indiques dans les paragraphes correspondants. NOTE La technologie dinterconnexion sans soudure fait reference a une methode de montage qui ne fait pas partie du processus de montage en surface et les composants ne subissent pas doperation de brasage. Ces composants sont inclus dans le present document car le montage des composants pour linterconnexion sans soudure se produit generalement apres le montage des CMS. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) ajout d’un nouveau paragraphe 4.2 - Classification des ensembles electroniques; b) ajout d’un nouveau paragraphe 4.4.8 - Lignes de fuite et distances d’isolement - Coordination de l’isolement; c) ajout d’un nouveau paragraphe 4.9 - Performances thermiques et electriques; d) mise a jour de l’article 6 - Brasage (contient desormais des exigences concernant l’application de brasage a basse temperature); e) ajout d’un nouveau paragraphe 6.2.2 - Alliages a braser couramment utilises; f) mise a jour du paragraphe 6.3.6 - Resistance au vide pendant le brasage; g) mise a jour du paragraphe 6.3.7 - Resistance aux produits et procedes de nettoyage (contient desormais les tests decrits dans l’IEC 60068-2-88, Essais - Essai XD: resistance des composants et des assemblages aux produits de nettoyage liquides); h) ajout d’un nouveau paragraphe 6.3.9 - Reprise des composants brases; i) ajout d’une nouvelle Annexe B - Durabilite.