Active standard | Published: 20/04/2012

IEC 61837-1-ed.2.0

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
(Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 1: Encombrements des enveloppes en plastique moulees)

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Detail information

Designation: IEC 61837-1-ed.2.0

Publication date: 20/04/2012

Pages: 44

Country: International technical standard

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Anotation

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. This publication is to be read in conjunction with IEC 61240:1994. La CEI 61837-1:2012 traite des encombrements normalises et connexions des sorties des dispositifs a montage en surface pour la commande et le choix de la frequence, applicables aux enveloppes en plastique moulees, et elle est basee sur la CEI 61240. Cette publication doit etre lue conjointement avec la CEI 61240:1994.

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