IEC 62047-37-ed.1.0

Detail information

Designation: IEC 62047-37-ed.1.0

Publication date: 28/04/2020

Pages: 0

Country: International technical standard

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Anotation

IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors. This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution. L’IEC 62047-37:2020 specifie les methodes d’essai permettant d’apprecier la durabilite des materiaux des couches minces piezoelectriques MEMS soumis a la contrainte d’environnement de temperature et d’humidite, a la contrainte et a la deformation mecaniques, ainsi que les conditions d’essai definissant une evaluation appropriee de la qualite. Plus specifiquement, le present document specifie les methodes et conditions d’essai permettant de mesurer la durabilite d’un DUT dans differentes conditions de temperature et d’humidite, et sous differentes tensions appliquees. Il applique en outre les appreciations aux proprietes liees a l’effet direct de la piezoelectricite, pour des couches minces piezoelectriques formees principalement a base de substrats de silice, c’est-a-dire les couches minces piezoelectriques utilisees comme capteurs acoustiques, ou comme capteurs de vibrations. Le present document ne couvre pas les evaluations de fiabilite, telles que les methodes permettant de prevoir la duree de vie d’une couche mince piezoelectrique en se basant sur la loi de Weibull.