Active standard | Published: 26/01/2009

IEC 62137-1-4-ed.1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
(Technologie de montage en surface - Methodes d´essais d´environnement et d´endurance des joints brases montes en surface - Partie 1-4: Essai de flexion cyclique)

Available languages: English and French

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Detail information

Designation: IEC 62137-1-4-ed.1.0

Publication date: 26/01/2009

Pages: 25

Country: International technical standard

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Anotation

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. La methode dessai decrite dans la CEI 62137-1-4:2009 sapplique aux composants pour montage en surface avec un plan de base fin et large tel que les QFP ou les BGA. La presente methode dessai evalue lendurance des joints de soudure situes entre les broches de raccordement et les plages de connexion sur un substrat par flexion cyclique de ce dernier. Cet essai evalue egalement les effets des contraintes mecaniques repetees, tels que le fait dappuyer sur les touches dun telephone cellulaire, sur la resistance du joint de soudure situe entre les bornes du composant et les plages de connexion sur un substrat.

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