Active standard | Published: 08/11/2011

IEC 62137-3-ed.1.0

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
(Techniques d´assemblage des composants electroniques - Partie 3: Guide de choix des methodes d´essai d´environnement et d´endurance des joints brases)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

from 382.50 EUR show on eshop

Detail information

Designation: IEC 62137-3-ed.1.0

Publication date: 08/11/2011

Pages: 90

Country: International technical standard

Where to buy?

You can buy at www.mystandards.biz

Anotation

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: - no technical changes; - some editorial changes and corrections; - for the sake of convenience some constitutive changes. La CEI 62137-3:2011 presente la methodologie de choix dune methode dessai appropriee a un essai de fiabilite des joints brases de divers types et formes de dispositifs montes en surface (CMS), de dispositifs du type en reseau, de dispositifs a connexions filaires et de dispositifs du type a insertion de connexions, utilisant divers types dalliages de materiaux de soudure. Cette premiere edition annule et remplace la CEI/PAS 62137-3, publiee en 2008, et comporte des modifications editoriales. Les principales modifications par rapport au PAS sont les suivantes: - pas de modifications techniques; - des corrections et modifications editoriales; - un reagencement du document.

Popular Publishers

full catalog